The advantages of plasma process using a low-pressure discharge.?

In the plasma deposition process an Element is evaporated, the gas atoms are ionized and they travel through a vacuum space to another surface which is oppositely charged, they attach themselves to that surface. the deposition is pure, very clean, very even and of equal thickness all over. It is not oxidized because there is no oxygen. In a multi step process one element can be deposited over another. Any element can be deposited using this process even Diamond which is actually crystallized carbon. it is more expensive than plating but there are many advantages. There are also other disadvantages.

It depends on the application. PVD and CVD are processes that often involve plasma. These are used in, among other things, production of integrated circuits (ICs or "computer chips") and have been for as long as ICs have existed. For one thing, PVD can be used to deposit very thin, very high quality, very pure layers of "stuff". Check out Wikipedia for "sputtering".