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Thermal paste question?
I am using some MX-4 thermal paste with the stock cooler on an i7 930. I think I applied it correctly but I am still idling at 60*. I know they say it doesn't have a burn-in time but even if it did should it be doing this from the start? Also, I would appreciate input on the best method to use as spreading it with a card was a major PitA. I know they say to only use a drop the size of a grain of white rice but that didn't spread all the way across the chip.
1 Answer
- ChuckLv 61 decade agoFavorite Answer
The thermal paste fills voids in the contact surfaces between the heat sink and the IC. A good thermal path also requires pressure between the heat sink and the IC.
The difficulty could be any of:
insufficient pressure between the IC and its heat sink
too much or two little thermal paste
uneven or warped surface of the IC or heat sink
some particulate matter between the IC and heat sink preventing effective contact
I would recommend dis-assembly, cleaning and careful inspection to see what is going on.
Also consider using a more capable heat sink - perhaps one with heat pipes to conduct heat away to a larger convection area directly in the path of a fan
Source(s): MSEE
